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Revision as of 11:01, 7 August 2023
Building 3x2 (1L3M) |
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| Energized Plate | High-Density Frame | IC Chip | Building 3x2 (1L3M) | |
|---|---|---|---|---|
| Construction | Time |
|---|---|
| 3.0 seconds | |
| [[{{{14}}}]] | Time |
| [[File:{{{14}}}.png|64x64px|link={{{14}}}]] | {{{15}}} seconds |
| [[{{{16}}}]] | Time |
| [[File:{{{16}}}.png|64x64px|link={{{16}}}]] | {{{17}}} seconds |
