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Revision as of 11:01, 7 August 2023
Building 3x2 (1L3M) |
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Energized Plate | High-Density Frame | IC Chip | Building 3x2 (1L3M) | |
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Construction | Time |
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3.0 seconds |
[[{{{14}}}]] | Time |
[[File:{{{14}}}.png|64x64px|link={{{14}}}]] | {{{15}}} seconds |
[[{{{16}}}]] | Time |
[[File:{{{16}}}.png|64x64px|link={{{16}}}]] | {{{17}}} seconds |