Building 3x2 (1L3M) |
||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
||||||||||||||||||||||
|
||||||||||||||||||||||
| Energized Plate | High-Density Frame | IC Chip | Building 3x2 (1L3M) | |
|---|---|---|---|---|
| Construction | Time |
|---|---|
| 3.0 seconds | |
| [[{{{14}}}]] | Time |
| [[File:{{{14}}}.png|64x64px|link={{{14}}}]] | {{{15}}} seconds |
| [[{{{16}}}]] | Time |
| [[File:{{{16}}}.png|64x64px|link={{{16}}}]] | {{{17}}} seconds |
