High-Density Frame

From Desynced Wiki
High-Density Frame
     
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Cannot access the database: :real_connect(): (HY000/1226): User 'o11612650' has exceeded the 'max_user_connections' resource (current value: 20)
Cannot access the database: :real_connect(): (HY000/1226): User 'o11612650' has exceeded the 'max_user_connections' resource (current value: 20)



Cannot access the database: :real_connect(): (HY000/1226): User 'o11612650' has exceeded the 'max_user_connections' resource (current value: 20)
Required Technology
Gateway Technology Gateway Technology



Recipe Uses

AMAC
Output 10
High-Density Frame
10
Low-Density Frame
10
Microprocessor
10
High-Density Frame
Produced By 24 secs
Construction


Blight Wall
Output 2
Blight Crystal Chunk
2
High-Density Frame


Produced By 20 secs
Construction


Building 1x1 (L)
Output 4
Circuit Board
5
High-Density Frame


Produced By 3 secs
Construction


Building 2x1 (1M) (Stockpile)
Output 5
Fused Electrodes
5
High-Density Frame
2
IC Chip

Produced By 3 secs
Construction


Building 2x1 (1M1L)
Output 4
Energized Plate
5
High-Density Frame
1
IC Chip

Produced By 3 secs
Construction


Building 2x2 (1M3S)
Output 7
Fused Electrodes
5
High-Density Frame
3
IC Chip

Produced By 3 secs
Construction


Building 2x2 (2M1L)
Output 8
Energized Plate
5
High-Density Frame
2
IC Chip

Produced By 3 secs
Construction


Building 2x2 (2M1L) (Epic Structures) (A)
Output 10
Fused Electrodes
10
High-Density Frame
2
IC Chip

Produced By 3 secs
Construction


Building 2x2 (2M1L) (Epic Structures) (B)
Output 8
Fused Electrodes
5
High-Density Frame
2
IC Chip

Produced By 3 secs
Construction


Building 3x2 (1L3M)
Output 20
Fused Electrodes
15
High-Density Frame
10
IC Chip
20
Fused Electrodes
Produced By 3 secs
Construction


Building 3x2 (2M2S)
Output 10
High-Density Frame
10
IC Chip
5
Refined Crystal

Produced By 3 secs
Construction


Command Center (Bot)
Output 20
Fused Electrodes
20
High-Density Frame
10
IC Chip

Produced By 16 secs
Robotics Assembler


Drone
Output 1
Cable
2
Circuit Board
1
High-Density Frame

Produced By 24 secs
Drone Component
16 secs
Drone Launcher

Engineer
Output 2
Fused Electrodes
2
High-Density Frame
1
IC Chip

Produced By 12 secs
Robotics Assembler


Foundation (Advanced)
Output 5
Foundation Plate
1
High-Density Frame


Produced By 1 secs
Construction


Gate
Output 1
Crystal Powder
1
High-Density Frame


Produced By 20 secs
Construction


Hauler
Output 5
Circuit Board
5
High-Density Frame
5
Optic Cable

Produced By 16 secs
Robotics Assembler


Hound
Output 10
Circuit Board
5
High-Density Frame
2
Optic Cable

Produced By 16 secs
Robotics Assembler


Hybrid Obsidian Soldier
Output 1
Anomaly Heart
10
High-Density Frame
20
Shaped Obsidian

Produced By 32 secs
Alien Factory


Hybrid Worker
Output 1
Anomaly Heart
2
High-Density Frame
10
Shaped Obsidian

Produced By 32 secs
Alien Factory


Mark V
Output 2
Fused Electrodes
15
High-Density Frame
5
IC Chip

Produced By 16 secs
Robotics Assembler


Re-Simulator
Output 50
Circuit Board
50
Crystal Powder
50
High-Density Frame
50
Circuit Board
Produced By 30 secs
Construction


Re-simulator
Output 50
Circuit Board
50
Crystal Powder
50
High-Density Frame
50
Circuit Board
Produced By 30 secs
Construction


Rock
Output 10
High-Density Frame
5
IC Chip
20
Optic Cable

Produced By 16 secs
Robotics Assembler


Scout
Output 2
Fused Electrodes
3
High-Density Frame
1
IC Chip

Produced By 12 secs
Robotics Assembler


Storage Block (24)
Output 5
High-Density Frame
1
IC Chip


Produced By 3 secs
Construction


Transport Bot
Output 2
Circuit Board
5
High-Density Frame
5
Optic Cable

Produced By 9 secs
Robotics Assembler


Alien Decryption Key
Output 1
CPU
1
High-Density Frame
10
Power Petal

Produced By 8 secs
Alien Factory


Alien Factory
Output 10
Blight Plasma
10
High-Density Frame
20
Obsidian Brick

Produced By 30 secs
Assembler


AOE Repair Component
Output 2
High-Density Frame
3
IC Chip


Produced By 10 secs
Assembler


Blight Container Medium
Output 4
Crystal Powder
4
High-Density Frame


Produced By 16 secs
Assembler


Blight Container Small
Output 2
Crystal Powder
2
High-Density Frame


Produced By 8 secs
Assembler


Blight Destabilizer
Output 5
High-Density Frame
3
Infected Circuit Board


Produced By 3 secs
Assembler


Blight Extractor
Output 10
Crystal Powder
2
High-Density Frame


Produced By 8 secs
Assembler


Component Recycler
Output 5
High-Density Frame
3
Infected Circuit Board
1
Virus Source Code

Produced By 6 secs
Assembler


Data Analyzer
Output 5
High-Density Frame
5
IC Chip
5
Optic Cable

Produced By 24 secs
Assembler


Drone Port
Output 2
Circuit Board
1
High-Density Frame


Produced By 8 secs
Assembler


Hybrid Beam Cannon
Output 3
CPU
1
Energized Artifact
10
High-Density Frame

Produced By 30 secs
Alien Factory


Hyper Shield Generator
Output 10
Blight Plasma
1
High-Density Frame
1
IC Chip

Produced By 6 secs
Assembler


Internal Blight Container
Output 2
Crystal Powder
1
High-Density Frame


Produced By 8 secs
Assembler


Large Efficiency Module
Output 10
High-Density Frame
10
IC Chip


Produced By 20 secs
Assembler


Large Health Module
Output 10
High-Density Frame
10
IC Chip


Produced By 20 secs
Assembler


Large Speed Module
Output 10
High-Density Frame
10
IC Chip


Produced By 20 secs
Assembler


Large Storage
Output 1
Fused Electrodes
5
High-Density Frame
10
Optic Cable

Produced By 6 secs
Assembler


Large Visibility Module
Output 10
High-Density Frame
10
IC Chip


Produced By 20 secs
Assembler


Large Wind Turbine
Output 3
Circuit Board
2
High-Density Frame
10
Wire

Produced By 20 secs
Assembler


Laser Turret
Output 10
Fused Electrodes
5
High-Density Frame
10
Refined Crystal

Produced By 1 secs
Assembler


Launch Pad
Output 5
High-Density Frame
10
Microprocessor


Produced By 8 secs
Assembler


Medium Battery
Output 2
High-Density Frame
1
IC Chip
10
Refined Crystal

Produced By 16 secs
Assembler


Medium Efficiency Module
Output 8
High-Density Frame
8
IC Chip


Produced By 16 secs
Assembler


Medium Health Module
Output 8
High-Density Frame
8
IC Chip


Produced By 16 secs
Assembler


Medium Speed Module
Output 8
High-Density Frame
8
IC Chip


Produced By 16 secs
Assembler


Medium Storage
Output 10
Cable
6
High-Density Frame


Produced By 4 secs
Assembler


Medium Visibility Module
Output 8
High-Density Frame
8
IC Chip


Produced By 16 secs
Assembler


Photon Beam
Output 5
Crystal Powder
5
High-Density Frame
5
IC Chip

Produced By 1 secs
Assembler


Photon Cannon
Output 5
High-Density Frame
5
IC Chip
2
Refined Crystal

Produced By 1 secs
Assembler


Plasma Cannon
Output 10
Blight Plasma
5
CPU
5
High-Density Frame

Produced By 6 secs
Assembler


Plasma Turret
Output 10
Blight Bar
2
High-Density Frame
3
IC Chip

Produced By 6 secs
Assembler


Power Core
Output 20
High-Density Frame
5
IC Chip
20
Robotics Datacube

Produced By 24 secs
Assembler


Power Transmitter
Output 2
Circuit Board
2
High-Density Frame
10
Wire

Produced By 5 secs
Assembler


Pulse Disruptor Attack
Output 5
High-Density Frame
5
Refined Crystal


Produced By 1 secs
Assembler


Robot Re-Simulation Component
Output 20
Circuit Board
20
Crystal Powder
20
High-Density Frame
20
Circuit Board
Produced By 30 secs
Assembler


Small Efficiency Module
Output 5
High-Density Frame
5
IC Chip


Produced By 12 secs
Assembler


Small Health Module
Output 5
High-Density Frame
5
IC Chip


Produced By 12 secs
Assembler


Small Intel Scanner
Output 5
High-Density Frame
1
IC Chip
10
Silicon

Produced By 4 secs
Assembler


Small Radar
Output 2
High-Density Frame
5
Optic Cable


Produced By 6 secs
Assembler


Small Speed Module
Output 5
High-Density Frame
5
IC Chip


Produced By 12 secs
Assembler


Small Storage
Output 1
Circuit Board
1
High-Density Frame


Produced By 4 secs
Assembler


Small Visibility Module
Output 5
High-Density Frame
5
IC Chip


Produced By 12 secs
Assembler


Solar Panel
Output 5
High-Density Frame
1
IC Chip
5
Refined Crystal

Produced By 6 secs
Assembler


Turret
Output 5
High-Density Frame
10
Wire


Produced By 1 secs
Assembler


Unit Teleporter
Output 10
CPU
20
High-Density Frame
20
Obsidian Brick
10
CPU
Produced By 16 secs
Alien Factory


Viral Pulse Attack
Output 5
High-Density Frame
2
Infected Circuit Board


Produced By 6 secs
Assembler


Virus Destabilizer
Output 5
High-Density Frame
3
Infected Circuit Board
1
Virus Source Code

Produced By 6 secs
Assembler


Virus Possessor
Output 5
High-Density Frame
3
Infected Circuit Board


Produced By 6 secs
Assembler


Virus Ray
Output 5
High-Density Frame
3
Infected Circuit Board


Produced By 6 secs
Assembler


Datacube Matrix
Output 2
High-Density Frame
2
Optic Cable


Produced By 64 secs
Robotics Assembler


Drone Package
Output 1
Cable
2
Circuit Board
1
High-Density Frame

Produced By 24 secs
Robotics Assembler


Robotics Datacube
Output 2
Crystal Powder
1
High-Density Frame


Produced By 40 secs
Robotics Assembler